The NTC thermistor chip (blue film package) is an indispensable component in the infrared temperature sensor Thermopile. NTC is the most sensitive temperature sensor (small temperature change causes an electrical signal exponential change). In the thermopile, the reference ambient temperature is tested. Different ambient temperature pyroelectric sensors have a great influence, causing stray and interference signals. NTC thermistors are used to calibrate and measure the temperature data in the pyroelectric state. The temperature signal calibration compensation finally obtains the accurate temperature of the measured object. The NTC chip will be fixed in the infrared thermopile by the bonding packaging process, which plays the role of temperature monitoring.
Pyroelectric infrared sensors convert thermal radiation into electrical signals according to the "Planck Blackbody Radiation Law". All objects above absolute zero (-273.15 ° C) radiate energy with different wavelengths and different intensities according to different temperatures. See Figure 2. After presetting a given wavelength (abscissa), the thermal sensor grasps the intensity (ordinate) to obtain the curve of the temperature of the measured object (the curve of the intersection of the vertical and horizontal coordinates-junior high school knowledge), each temperature corresponds to a different thermal release Current.
Don't care how complicated Planck's radiation law seems to be, it's just a regression equation. Engineers doing material design come up with N such "laws of soil" in a year. e (2.17828) is a natural constant, a natural code followed by all natural sciences.
The pyroelectric element does not emit energy by itself, and the red light spot is used for sighting during temperature measurement, not pyroelectric radiation, and there is no need to worry about the harmful effects of radiation.
Our professional R & D and production of high-precision, high-reliability NTC chips, fast response, high cost performance, good consistency, small size, good stability, are widely used in bonding, such as infrared thermopile, IGBT, integrated module, semiconductor Modules, power modules, infrared temperature sensors, etc.
